SUBSTRATE FOR POWER MODULE AND MANUFACTURING METHOD THEREFOR

摘要

Provided is a substrate for a power module that reduces micro voids in join sections and prevents detachment and a manufacturing method therefor. In the present invention a metal plate made of aluminum or an aluminum alloy is joined to at least one face of a ceramic substrate by brazing. When a cross section of the metal plate within a region 200µm wide from the side edge of the metal plate and within a depth of 5µm from the joining interface between the metal plate and the ceramic substrate is observed at 3000x magnification with a scanning electron microscope the total length of consecutive residual oxide that is present consecutively for 2µm or more along the joining interface is 70% or less relative to the viewing length.