METODO DI FABBRICAZIONE DI UN ASSEMBLAGGIO DI PIASTRINE AVENTE SPESSORE RIDOTTO E RELATIVO ASSEMBLAGGIO DI PIASTRINE

摘要

A method for manufacturing a die assembly, including the steps of: bonding a first wafer of semiconductor material to a second wafer, the second wafer including a respective semiconductor body having a respective initial thickness and forming an integrated electronic circuit; and subsequently reducing the initial thickness of the semiconductor body of the second wafer; and subsequently bonding the second wafer to a third wafer, the third wafer forming a micro-electromechanical sensing structure.