| 主权项 |
1. A molded semiconductor package, having an edge to the molded portion of the package, a leadframe having top and bottom surfaces and a thickness therebetween, a plurality of leads, and a dam bar separated from the package edge, comprising:
at least one pair of adjoining leads and a dam bar having a transverse portion extending between the adjoining leads; and a first barrier in the form of a groove formed over the top surface of each of the at least one pair of adjoining leads, wherein the first barrier is separated by a space from the package edge, the first barrier extending to the outward portion of the dam bar, wherein the first barrier is configured to prevent one or more of the plurality of components associated with the molding compound from bleeding onto surface of the exterior region of the leads. |
