| 摘要 |
PROBLEM TO BE SOLVED: To achieve adaptation to chip components differing in thickness and outer shape and unevenness on a substrate side when many chips are mounted together at a time.SOLUTION: There is provided a chip housing tool as a mounted-component housing tool for arranging a plurality of components (for example, a plurality of chip components 21, 22) to be mounted on a predetermined substrate 5 at predetermined positions. A plurality of component housing pockets 33 where chip components are positioned are arrayed respectively, and an elastic material sheet 32 having a predetermined thickness is arranged as a step absorbing member at a bottom surface part in each of the component housing pockets 33. Thus, elastic material sheets 32 as step absorbing members are arranged right below the chip components 21, 22, so the many chip components 21, 22 can be mounted together at a time adaptively to both differences in thickness and outer shape of the chip components 21, 22 and unevenness on the side of the substrate 5. |
