发明名称 研磨パッドおよび研磨パッドの製造方法
摘要 PROBLEM TO BE SOLVED: To provide a polishing pad capable of suppressing scratches on an article to be polished while securing a polishing rate.SOLUTION: The polishing pad 10 includes a urethane sheet 2 formed of polyurethane resin, through a wet solidification method, having a flow initiation temperature of 150 to 220°C. The urethane sheet 2 has, on one surface side, a protruded part 5 and a recessed part 6 formed between the protruded parts 5. The surface of the protruded part 5 constitutes a polishing surface P. The protruded part 5 has a large number of fine pores 4 of 30 μm or less in an average hole diameter. The fine pores 4 are opened on the surface of the protruded part 5 to form the opened fine pores 4a. Ultrafine pores 4s smaller than the fine pores 4 are formed in the recessed part 6, wherein the pores opened on the surface are reduced in diameter than the fine pores 4 of the protruded part 5 or sealed. In the urethane sheet 2, the opened bubble pores having length in the thickness direction are not formed, and a polishing liquid is circularly supplied with the recessed part 6, causing polishing waste to be discharged.
申请公布号 JP5711525(B2) 申请公布日期 2015.04.30
申请号 JP20100285527 申请日期 2010.12.22
申请人 富士紡ホールディングス株式会社 发明人 宮澤 文雄;立野 哲平
分类号 B24B37/24;B24B37/11;H01L21/304 主分类号 B24B37/24
代理机构 代理人
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