SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

摘要

A device includes a first semiconductor chip including a first face, wherein a first contact pad is arranged over the first face. The device further includes a second semiconductor chip including a first face, wherein a first contact pad is arranged over the first face, wherein the first semiconductor chip and the second semiconductor chip are arranged such that the first face of the first semiconductor chip faces in a first direction and the first face of the second semiconductor chip faces in a second direction opposite to the first direction. The first semiconductor chip is located laterally outside of an outline of the second semiconductor chip.

主权项

1. A method, comprising:
providing an electrically conductive foil attached on a carrier; exposing at least one portion of the carrier by removing at least one portion of the electrically conductive foil; attaching a first semiconductor chip to a non-removed portion of the electrically conductive foil, wherein the first semiconductor chip comprises a first contact pad arranged over a first face of the first semiconductor chip and a second contact pad arranged over a second face of the first semiconductor chip, wherein the second contact pad is at least one of electrically or thermally coupled to the electrically conductive foil and wherein the first contact pad is electrically coupled to the electrically conductive foil; and forming a first electrically conductive layer over the first semiconductor chip.