TEMPERATURE CONTROL MECHANISM, TEMPERATURE CONTROL METHOD, AND SUBSTRATE PROCESSING APPARATUS

摘要

Provided is a temperature control mechanism that has: a plurality of pairs of a heater and a thyristor, said pairs being provided at least one by one corresponding to each of a plurality of regions formed by segmenting an electrostatic chuck on which a substrate is to be placed; one power supply that supplies a current from the thyristor to the heater of each of the pairs; and at least one pair of filters, which are provided on a power supply line that supplies power to the heaters from the one power supply, and which remove high-frequency power applied to the power supply.