| 摘要 |
<p>The present invention relates to an insulating substrate for a printed circuit board and a printed circuit board and, more specifically, an insulating substrate for a printed circuit board and a printed circuit board, by which the plating of filling material of via hole of an inner layer can be improved. The insulating substrate for the printed circuit board comprises: an electric insulation resin; and reinforcing elements of a plurality of layers formed in the electrical insulation resin, wherein the reinforcing elements of the plurality of layers are formed by symmetrically placing at least one reinforcing element respectively in the top and the bottom on the basis of a central reinforcing element formed in a central part in the electric insulation resin, and the thickness of the central reinforcing element is thicker than the remaining reinforcing elements. The printed circuit board comprises: an insulating substrate; and a via penetrating the insulating substrate, wherein the insulating substrate comprises an electric insulation resin, and reinforcing elements of a plurality of layers formed in the electric insulation resin, in which the reinforcing elements of the plurality of layers are formed by symmetrically placing at least one reinforcing element respectively in the top and the bottom on the basis of a central reinforcing element formed in a central part in the electric insulation resin, and the thickness of the central reinforcing element is thicker than the remaining reinforcing elements.</p> |
