| 摘要 |
<p>The present invention relates to a method of coating an LED phosphor per cell on a wafer. The present invention includes: a step of cutting a wafer which has a light emitting structure where a clad layer is formed on/beneath an active layer into light emitting diode cells, a step of attaching the light emitting diode cells to a main carrier substrate to be separated from each other, a step of forming a first sub bonding layer as an adhesive on the sub carrier substrate, and applying phosphor onto the first subs bonding layer with a pattern which corresponds to the arrangement of the light emitting diode cells by a screen printing method, and forming a phosphor layer, a step of applying an adhesive onto the phosphor layer with a pattern which corresponds to the arrangement of the light emitting diode cells by a screen printing method, and forming a first main bonding layer, a step of bonding the first main bonding layer to the corresponding light emitting diode cells, and a step of separating a sub carrier substrate from the phosphor layer. According to the method of coating an LED phosphor per cell on a wafer, phosphor is applied to a light emitting diode cell cut by a cutting process with a bonding method. Thereby, a manufacturing process is easily performed, the distribution deviation of the phosphor is prevented, and damage to the phosphor can be prevented.</p> |
