| 摘要 |
A wafer-related data creation device 47 comprising a setting stand for setting wafer pallets, a test-use suction nozzle 51 for picking up die 31 on dicing sheet 34 of a wafer pallet set on the setting stand, test-use pusher pin 53 for pushing up the adhesive section of die 31 from dicing sheet 34 which is being attempted to be picked up by test-use suction nozzle 51, and test-use camera 54 for capturing an image of die 31 on dicing sheet 34 is used, the wafer pallet for which wafer-related data is to be created is set on the setting stand of wafer-related device creation device 47, an image captured by test-use camera 54 is processed, pusher movement of test-use pusher pin 53 and die pickup movement of test-use pickup nozzle 51 is performed and wafer-related data is created. |
