| 发明名称 |
Detecting IC Reliability Defects |
| 摘要 |
Methods and systems for detecting reliability defects on a wafer are provided. One method includes acquiring output for a wafer generated by an inspection system. The method also includes determining one or more geometric characteristics of one or more patterned features formed on the wafer based on the output. In addition, the method includes identifying which of the one or more patterned features will cause one or more reliability defects in a device being formed on the wafer based on the determined one or more characteristics. |
| 申请公布号 |
US2015120220(A1) |
申请公布日期 |
2015.04.30 |
| 申请号 |
US201414512446 |
申请日期 |
2014.10.12 |
| 申请人 |
KLA-Tencor Corporation |
发明人 |
Wu Joanne;Chang Ellis;Gao Lisheng;Kurada Satya;Park Allen;Babulnath Raghav |
| 分类号 |
G01N21/95 |
主分类号 |
G01N21/95 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A computer-implemented method for detecting reliability defects on a wafer, comprising:
acquiring output for a wafer generated by an inspection system; determining one or more characteristics of one or more patterned features formed on the wafer based on the output; and identifying which of the one or more patterned features will cause one or more reliability defects in a device being formed on the wafer based on the determined one or more characteristics, wherein said acquiring, said determining, and said identifying are performed by a computer system. |
| 地址 |
Milpitas CA US |
