| 发明名称 |
A CHEMICAL MECHANICAL POLISHING COMPOSITION FOR POLISHING SILICON WAFERS AND RELATED METHODS |
| 摘要 |
<p>A chemical mechanical polishing composition for polishing silicon wafers is provided, containing: water, optionally, an abrasive; a cation according to formula (I); piperazine or a piperazine derivative according to formula (II); and, a quaternary ammonium compound; wherein the chemical mechanical polishing composition exhibits a pH of 9 to 12. Also provided are methods of making and using the chemical mechanical polishing composition.</p> |
| 申请公布号 |
SG10201406038Q(A) |
申请公布日期 |
2015.04.29 |
| 申请号 |
SG10201406038Q |
申请日期 |
2014.09.24 |
| 申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.;NITTA HAAS INC. |
发明人 |
YASUYUKI ITAI;NARESH KUMAR PENTA;NAOKO KAWAI;HIROYUKI NAKANO;SHINICHI HABA;YOSHIHARU OTA;TAKAYUKI MATSUSHITA;MASASHI TERAMOTO;SAKIKO NAKASHIMA;TOMOYUKI TODA;KOICHI YOSHIDA;LEE MELBOURNE COOK |
| 分类号 |
C09G1/02;C09G1/04;C09K13/00;H01L21/302;H01L21/306 |
主分类号 |
C09G1/02 |
| 代理机构 |
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