| 发明名称 | Method of forming a microchannel cooled component | ||
| 摘要 | A method of forming a microchannel cooled component is provided. The method includes forming at least one microchannel within a surface of a relatively planar plate. The method also includes placing a relatively planar cover member over the surface having the at least one microchannel formed therein. The method further includes adhering the relatively planar cover member to the relatively planar plate. The method yet further includes curving the microchannel cooled component by pressing the relatively planar cover member with a forming component for at least a portion of a time period of adhering the relatively planar cover member to the relatively planar plate. | ||
| 申请公布号 | US9015944(B2) | 申请公布日期 | 2015.04.28 |
| 申请号 | US201313774275 | 申请日期 | 2013.02.22 |
| 申请人 | General Electric Company | 发明人 | Lacy Benjamin Paul;Dimascio Paul Stephen;Kottilingam Srikanth Chandrudu;Schick David Edward |
| 分类号 | B23P15/00;B23P17/00;B23P15/02;F23R3/00 | 主分类号 | B23P15/00 |
| 代理机构 | Cantor Colburn LLP | 代理人 | Cantor Colburn LLP |
| 主权项 | 1. A method of forming a microchannel cooled component comprising: forming at least one microchannel within a surface of a relatively planar plate; placing a relatively planar cover member over the surface having the at least one microchannel formed therein; adhering the relatively planar cover member to the relatively planar plate; and curving the microchannel cooled component by pressing the relatively planar cover member with a forming component for at least a portion of a time period of adhering the relatively planar cover member to the relatively planar plate. | ||
| 地址 | Schenectady NY US | ||