Circuit module and method of producing circuit module

摘要

A circuit module includes a circuit substrate, at least one mount component, sealing bodies, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a first sealing body section having a first thickness and a second sealing body section having a second thickness larger than the first thickness. The shield covers the sealing body and has a first shield section formed on the first sealing body section and having a third thickness and a second shield section formed on the second sealing body section and having a fourth thickness smaller than the third thickness. The sum of the fourth thickness and the second thickness equals to the sum of the first thickness and the third thickness.

主权项

1. A method of producing a circuit module, comprising:
mounting mount components including an RF (Radio Frequency) component configuring an RF circuit on a mount surface of a circuit substrate, forming a sealing body for covering the mount component on the mount surface having a first sealing body section having a first thickness and a second sealing body section having a second thickness larger than the first thickness, the first sealing body section covering the RF component and not covering the mount component having a highest mount height from the mount surface among the mount components, the first thickness being smaller than the highest mount height of the mount component, the second sealing body section covering the mount component having the highest mount height from the mount surface among the mount components, and the second thickness being larger than the highest mount height of the mount component, forming a shield by coating a shielding material to form a plane parallel to the mount surface.