Light emitting diode package

摘要

A light emitting diode (LED) package includes a substrate, a first electrode, a second electrode, an LED die mounted on the substrate and electrically connected to the first and the second electrodes, and an encapsulation layer encapsulating the LED die. Both the first and the second electrodes are embedded in the substrate and spaced from each other. Each of the first and the second electrodes includes a top face and a bottom face, with the top face and the bottom face thereof being exposed at a top surface and a bottom surface of the substrate, respectively. The top face of the first electrode defines a first groove therein. An oxidation-resistant metal coating layer is filled in the first groove. A positive bonding pad of the LED die directly contacts with a top face of the first oxidation-resistant metal coating layer.

主权项

1. A light emitting diode (LED) package comprising:
a substrate comprising a top surface and a bottom surface; a first electrode and a second electrode spaced from the first electrode, both the first and the second electrodes being embedded in the substrate, both the first and the second electrodes comprising a top face and a bottom face, the top faces of the first and the second electrodes being exposed at the top surface of the substrate, and the bottom faces of the first and the second electrodes being exposed at the bottom surface of the substrate; an LED die mounted on the top surface of the substrate and respectively electrically connected to the first and the second electrodes, the LED die comprising a positive bonding pad (p-pad) and a negative bonding pad (n-pad); and an encapsulation layer covered on the top surface of the substrate to encapsulate the LED die therein; wherein the top face of the first electrode defines a first groove therein, and a first oxidation-resistant metal coating layer is filled in the first groove, the p-pad of the LED die directly contacting with a top face of the first oxidation-resistant metal coating layer; wherein the top face of the second electrode defines a second groove therein, and a second oxidation-resistant metal coating layer is filled in the second groove, the n-pad of the LED die directly contacting with a top face of the second oxidation-resistant metal coating layer; wherein the first groove of the first electrode is located adjacent to a junction of the first electrode and the substrate, and the second groove of the second electrode is located adjacent to a junction of the second electrode and the substrate; wherein both the first and the second grooves are spaced from the substrate; and wherein the first groove is annular and defined along a periphery of the top face of the first electrode, and the second groove is annular and defined along a periphery of the top face of the second electrode.