发明名称 Semiconductor memory device and method for manufacturing the same
摘要 A semiconductor memory device according to an embodiment, includes a semiconductor substrate, a first insulating film provided on the semiconductor substrate, a silicon film including silicon provided on the first insulating film, a second insulating film provided on the silicon film, a hafnium alloy-containing film provided on the second insulating film, the hafnium alloy-containing film including oxygen and an alloy of hafnium and a metal other than hafnium, a third insulating film provided on the hafnium alloy-containing film, and an electrode provided on the third insulating film.
申请公布号 US9018061(B2) 申请公布日期 2015.04.28
申请号 US201414153384 申请日期 2014.01.13
申请人 Kabushiki Kaisha Toshiba 发明人 Itokawa Hiroshi
分类号 H01L21/336;H01L29/423;H01L29/788;H01L21/28 主分类号 H01L21/336
代理机构 Oblon, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A method for manufacturing a semiconductor memory device, comprising: forming a first insulating film on a semiconductor substrate; forming a silicon film including silicon on the first insulating film; forming a second insulating film on the silicon film; forming a metal film on the second insulating film by depositing a metal other than hafnium; depositing hafnium and oxygen on the metal film; forming a hafnium alloy-containing film by alloying the metal and the hafnium by performing heat treatment; forming a third insulating film on the hafnium alloy-containing film; and forming an electrode on the third insulating film.
地址 Minato-ku JP
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