| 发明名称 | Method and apparatus for repairing an electrostatic chuck device, and the electrostatic chuck device | ||
| 摘要 | In a repairing method for an electrostatic chuck device in which at least an adhesive layer and an attracting layer are provided on a metal base, a side surface of an eroded adhesive layer is wound with a string-like adhesive and thermal compression is performed thereafter. A repairing apparatus for an electrostatic chuck device, which is used in the repairing method, includes a rotatable table for rotating the electrostatic chuck device and a bobbin for supplying the adhesive to the adhesive layer. | ||
| 申请公布号 | US9017786(B2) | 申请公布日期 | 2015.04.28 |
| 申请号 | US201213572044 | 申请日期 | 2012.08.10 |
| 申请人 | Tokyo Electron Limited | 发明人 | Yoshioka Ken;Takahashi Syuichi;Sasaki Yasuharu |
| 分类号 | H01L21/687;H01L21/683;H01L21/67 | 主分类号 | H01L21/687 |
| 代理机构 | Oblon, McClelland, Maier & Neustadt, L.L.P. | 代理人 | Oblon, McClelland, Maier & Neustadt, L.L.P. |
| 主权项 | 1. An electrostatic chuck device comprising: a metal base; an adhesive layer provided on the metal base; an attracting layer provided on the adhesive layer, the attracting layer being attached to the metal base via the adhesive layer; and a string-shaped adhesive wound around an eroded side surface of the adhesive layer such that the string-shaped adhesive overlaps itself and is to be fused with the adhesive layer by thermal compression. | ||
| 地址 | Tokyo JP | ||