METAL WIRING LAYER FORMING METHOD, METAL WIRING LAYER FORMING APPARATUS, AND STORAGE MEDIUM

摘要

PROBLEM TO BE SOLVED: To provide a metal wiring layer forming method in which a metal wiring layer can be formed within a recess of a substrate and in which the metal wiring layer within the recess is not formed on the outside of the recess.SOLUTION: A metal wiring layer forming method includes the steps of: forming a catalyst layer 5 composed of Pd on a tungsten layer W provided on a bottom surface 3a of a recess 3 of a substrate 2 and not forming the catalyst layer 5 on a surface 3b of an insulation layer of the recess 3; and forming an Ni-based metal wiring layer 7 on the catalyst layer 5 of the recess 3.