| 发明名称 |
EUTECTIC SOLDER STRUCTURE FOR CHIP |
| 摘要 |
The present invention provides a eutectic solder structure for a chip including a substrate and a solder structure on the substrate. The solder structure includes an alternate lamination of a plurality of first metal layers and a plurality of second metal layers, wherein each second metal layer has a continuous region and a plurality of openings and the melting point of the plurality of second metal layers is higher than that of the plurality of first metal layers. The eutectic solder structure for a chip also includes a chip on the solder structure, wherein the chip is bonded to the substrate by a eutectic reaction of the solder structure. |
| 申请公布号 |
US2015108650(A1) |
申请公布日期 |
2015.04.23 |
| 申请号 |
US201414272468 |
申请日期 |
2014.05.07 |
| 申请人 |
LEXTAR ELECTRONICS CORPORATION |
发明人 |
CHEN Yi-Jyun |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A eutectic solder structure for a chip, comprising:
a substrate; a solder structure on the substrate, wherein the solder structure includes an alternate lamination of a plurality of first metal layers and a plurality of second metal layers, and wherein each second metal layer has a continuous region and a plurality of openings, and the melting point of the plurality of second metal layers is higher than that of the plurality of first metal layers; and a chip on the solder structure, wherein the chip is bonded to the substrate by an eutectic reaction of the solder structure. |
| 地址 |
Hsinchu TW |
