发明名称 HEATING AND COOLING CUP HOLDER
摘要 A heating and cooling cup holder may include a holder body having an opened upper end and a blast hole formed in a side surface of the holder body into which wind is introduced, a heat exchanging body having a front surface coupled to an outer side surface of the holder body to cover the blast hole and having an inlet formed in one side surface of the heat exchanging body to allow the wind introduced through the inlet to be heat-exchanged, a first peltier element having a front surface coupled to a rear surface of the heat exchanging body, a heat dissipating module coupled to a rear surface of the first peltier element, a second peltier element having an upper surface coupled to a lower surface of the holder body, and a heat pipe heat-exchangeably connecting a lower surface of the second peltier element to the heat dissipating module.
申请公布号 US2015107270(A1) 申请公布日期 2015.04.23
申请号 US201414515091 申请日期 2014.10.15
申请人 Hyundai Motor Company ;KBAUTOTECH CO., LTD. 发明人 Oh Man Ju;KIM Jae Woong;PARK Jae Woo;KIM Jae Hoon
分类号 B60N3/10;A47G23/02;F25B21/04 主分类号 B60N3/10
代理机构 代理人
主权项 1. A heating and cooling cup holder, comprising: a holder body having an opened upper end to accommodate a beverage, having a shape surrounding the beverage, and having a blast hole formed in a side surface of the holder body into which wind is introduced; a heat exchanging body having a front surface coupled to an outer side surface of the holder body to cover the blast hole and having an inlet formed in one side surface of the heat exchanging body to allow the wind introduced through the inlet to be heat-exchanged and discharged into the holder body through the blast hole; a first peltier element having a front surface coupled to a rear surface of the heat exchanging body; a heat dissipating module coupled to a rear surface of the first peltier element; a second peltier element having an upper surface coupled to a lower surface of the holder body; and a heat pipe heat-exchangeably connecting a lower surface of the second peltier element to the heat dissipating module.
地址 Seoul KR