发明名称 基板の接続構造、基板セット、光センサアレイ装置及び基板を接続する方法
摘要 <P>PROBLEM TO BE SOLVED: To provide a connection structure of substrates which connects two substrates electrically even if the relative position between two substrates is shifted during butt connection of the substrates. <P>SOLUTION: The connection structure of substrates includes a first substrate 11 having a first electrode plane 12 on which a plurality of first electrodes 15 are placed, and a second substrate 13 having a second electrode plane 14 on which a plurality of second electrodes 16 are placed and of which the second electrode plane 14 faces the first electrode plane 12. The plurality of second electrodes 16 are arranged to be shifted from the position on the second electrode plane 14 facing the first electrodes 15 in the direction opposite from the center C2 of the second electrode plane, excepting the center C2 of the second electrode plane 14. The plurality of second electrodes 16 are connected electrically with the facing first electrodes 15 via bumps 17. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5703784(B2) 申请公布日期 2015.04.22
申请号 JP20110015379 申请日期 2011.01.27
申请人 发明人
分类号 H01L21/60;H01L27/14;H01L27/146 主分类号 H01L21/60
代理机构 代理人
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