| 摘要 |
Provided is a semiconductor device. The semiconductor device comprises: a substrate in which a plurality of logic cells are provided; transistors in a plurality of logic cells; contacts connected to terminals of the transistors; first vias connected to upper surfaces of the contacts; and first wirings connected to upper surfaces of the first vias. The first wirings comprise a common conductive line which connects a plurality of logic cells through the first contacts. All first wirings have a long straight line form in one direction. |
