| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a pickup method capable of reliably picking up a thinned die.SOLUTION: In the present invention, when a die having been attached to a dicing tape is sucked by a collet to be picked up and bonded to a workpiece, compressed air is supplied from a side of the collet to a dicing region around the die, and the dicing tape is pushed down by the compressed air to push up the die, the compressed air being supplied to at least the dicing region.</p> |
