| 摘要 |
<p>The present invention provides a printed circuit board comprising: an insulation layer; a first and a second circuit pattern layer formed on an upper part and a lower part of the insulation layer; and one or more vias electrically conducting the first and the second circuit pattern layer by penetrating the insulation layer, wherein the sectional shape of the via is non-circular, and the width is in the range of 60 to 150μm, thereby improving heat radiation efficiency and preventing dimple.</p> |
