发光二极体;LIGHT EMITTING DIODE

摘要

一种发光二极体，包括具有电路结构的基板、至少一个发光二极体晶片和封装材料，发光二极体晶片设置于基板之上且与基板的电路结构电连接，封装材料设置在所述基板上并包覆发光二极体晶片。所述封装材料的表面包含至少一凹槽，所述凹槽的截面呈“V”形或梯形。本发明所提供的发光二极体的凹槽可以减少全反射现象的发生，从而提高了整个发光二极体的光输出效率。 A light emitting diode includes a substrate with a circuit structure, at least a light emitting diode chip and a packaging material. The light emitting diode chip is arranged on the substrate and electrically connected with the circuit structure of the substrate. The packaging material is arranged on the substrate and covers the light emitting diode chip. A surface of the packaging material includes at least a groove, and a section of the groove is a “V”