发明名称 |
METHOD OF MANUFACTURING LIQUID EJECTING HEAD |
摘要 |
Disclosed is a method of manufacturing a liquid ejecting head where first and second members with different sizes which are formed of silicon are laminated with an adhesive agent. The method includes measuring a distance between a reference point which is positionally aligned in the laminating direction with respect to an imaging unit and a surface which extends from the bonding surface of the second member, and imaging the bonding surface by calculating a focal point distance of the imaging unit based on the distance which is measured and a distance between the imaging unit and the reference point. |
申请公布号 |
US2015101732(A1) |
申请公布日期 |
2015.04.16 |
申请号 |
US201414508171 |
申请日期 |
2014.10.07 |
申请人 |
Seiko Epson Corporation |
发明人 |
Inaoka Yasuo;Kakizaki Jun;Fukuzawa Yuma;Watanabe Shunsuke |
分类号 |
B41J2/16;B32B37/12;B32B37/18;B32B38/00 |
主分类号 |
B41J2/16 |
代理机构 |
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代理人 |
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主权项 |
1. A method of manufacturing a liquid ejecting head in which members with different sizes which are formed of silicon are laminated with an adhesive agent and which ejects a liquid from a nozzle opening, the method comprising:
in a state where a first member where a shape of a surface on a bonding surface side is relatively small and a second member where a shape of a surface on a bonding surface side is larger than the first member are adhered to each other using the adhesive agent, when the bonding surface is imaged by transmitting infrared rays through the first member or the second member using an imaging unit which performs imaging using infrared rays from one side in a laminating direction, measuring a distance between a reference point which is positionally aligned in the laminating direction with respect to the imaging unit and a surface which extends from the bonding surface of the second member; and imaging the bonding surface by calculating a focal point distance of the imaging unit based on the distance which is measured and a distance between the imaging unit and the reference point. |
地址 |
Shinjuku-ku JP |