| 摘要 |
A heat transfer element 10 comprises a metal plate 12 having a thinned area forming a recess 16 and a metallic foam 14 disposed in the recess and bonded to the plate by sintering. The plate and foam may be made from copper. The foam may be bonded to the plate in the same sintering process as is used to manufacture the foam from a metal and non-metal powder mix, or alternatively the metallic foam and the plate may be formed as discrete components before being bonded by sintering. The heat transfer element may comprise of a flat surface placed on a heat source (computer processor) and a cooling fluid passed over the foam to draw heat away from the heat transfer element. The cooling fluid may be air or another gas blown by a fan or a pumped liquid. Holes 22 in the plate permit the heat transfer element to be screwed onto the heat source. |
