Flip chip packages with improved thermal performance

摘要

Systems and methods for improving thermal performance, such as thermal dissipation, of flip chip packages that include one or more flip chip dies are disclosed. In some embodiments, a thermal collection layer can be formed on a surface of a flip chip die. The thermal collection layer can be configured to dissipate heat generated by the flip chip die. In some variations, the thermal collection layer can be constructed using materials having high thermal conductivity.

主权项

1. A package comprising:
a substrate configured to support a flip chip die, the flip chip die including a first surface mounted on the substrate and a second surface opposite the first surface; a first thermal collection layer formed on the first surface of the flip chip die, the first thermal collection layer configured to dissipate heat generated by the flip chip die; and a second thermal collection layer formed on the second surface of the flip chip die, the second thermal collection layer configured to dissipate heat generated by the flip chip die, the substrate including at least one via formed along a thickness of the substrate and configured to facilitate conduction of heat away from the flip chip die, the at least one via including thermally conductive material configured to provide a thermal conductive path between the first thermal collection layer and a fluid medium surrounding the package.