| 摘要 |
The present invention relates to a surface mount package for a micro-electro-mechanical system (MEMS) microphone die and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components that simplifies manufacturing and lowers costs. The surface mount package features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the MEMS microphone die is mechanically attached, providing an interior surface for making electrical connections between the MEMS microphone die and the package, and providing an exterior surface for surface mounting the microphone package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The microphone package has a substrate with metal pads on its top and bottom surfaces, a sidewall spacer, and a lid. A MEMS microphone die is mounted on the substrate, and the substrate, the sidewall spacer, and the lid are joined together to form the MEMS microphone. |
| 主权项 |
1. A solder reflow surface mount micro-electro-mechanical system (MEMS) microphone, the microphone comprising:
a lid having top and bottom surfaces and comprising at least one conductive layer, at least one non-conductive layer, and an acoustic port, wherein at least one the conductive layer comprises the bottom surface of the lid, and wherein the bottom surface has an attachment region and an interior region, the attachment region positioned between the interior region and the edges of the lid, and completely bounding the interior region; a sidewall spacer having top and bottom surfaces and comprising at least two conductive layers with a center layer of non-conductive material having predefined thickness disposed between the two conductive layers, wherein one conductive layer comprises the top surface of the sidewall spacer and the other conductive layer comprises the bottom surface of the sidewall spacer, and wherein the sidewall spacer further comprises an opening having walls covered with conductive material, and the opening walls extend through the center layer to the top surface and the bottom surface; a substrate comprising:
a base layer comprised of at least one layer of non-conductive material, wherein the base layer has a planar top surface and a planar bottom surface, the top surface having an interior region and an attachment region, the attachment region disposed between the interior region and the edges of the base layer, and completely bounding the interior region;a first plurality of metal pads disposed on the top surface of the base layer, wherein at least one pad of the first plurality of metal pads is located in the attachment region of the top surface of the base layer;a second plurality of metal pads disposed on the bottom surface of the base layer, the second plurality of metal pads arranged to be within the edges of the base layer; andone or more electrical pathways disposed completely within the base layer, wherein the pathways electrically couple one or more of the first plurality of metal pads on the top surface of the base layer to one or more of the second plurality of metal pads on the bottom surface of the base layer, and wherein the at least one metal pad located in the attachment region of the top surface of the base layer is electrically coupled to one or more of the second plurality of metal pads; a MEMS microphone die mounted on the top surface of the base layer, and electrically coupled to at least one of the first plurality of metal pads on the top surface of the base layer; wherein the substrate, the sidewall spacer and the lid cooperate with each other to form a housing, wherein the edges of the substrate, the sidewall spacer and the lid create side surfaces substantially perpendicular to the bottom surface of the substrate, and wherein the housing has an internal acoustic chamber for the MEMS microphone die; wherein the bottom surface of the sidewall spacer is coupled to the attachment region of the top surface of the substrate such that the opening of the sidewall spacer and the interior region of the top surface of the substrate are aligned, and the conductive material on the opening walls of the sidewall spacer is electrically coupled to the at least one metal pad located in the attachment region of the substrate; wherein the top surface of the sidewall spacer is coupled to the attachment region of the bottom surface of the lid such that the opening of the sidewall spacer and the interior region of the bottom surface of the lid are aligned, and the conductive layer of the lid is electrically coupled to the conductive material on the opening walls of the sidewall spacer; and wherein the interior region of the top surface of the substrate, the opening walls of the sidewall spacer, and the interior region of the bottom surface of the lid, when attached, define the internal acoustic chamber for the MEMS microphone die. |
