| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an adhesive sheet for semiconductor processing capable of suppressing deformation of a core material due to heating.SOLUTION: An adhesive sheet 100 for semiconductor processing includes an adhesive resin layer 2 and an adhesive part 20 for ring frame holding on one surface of a support sheet 1. The adhesive part for ring frame holding is composed of adhesive layers 21a and 21b and a core material 22, and formed in an outer peripheral part of the support sheet or the adhesive resin layer. The dimensional change rate of the core material in an MD direction and in a CD direction after it is heated at 80°C for 30 minutes is -3 to +3%.</p> |
