发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can form a film having high productivity and high quality.SOLUTION: A substrate processing apparatus for sequentially supplying on a surface of a substrate, at least two types of reaction gases which react with each other with the substrate being placed on a rotary table provided in a chamber to form a film containing a reaction product of reaction gases on the surface of the substrate comprises: first reaction gas supply means for supplying a first reaction gas to the surface of the substrate; second reaction gas supply means for supplying a second reaction gas to the surface of the substrate; and heating means for heating the substrate, in which the first reaction gas supply means, the heating means and the second reaction gas supply means are arranged in a rotational direction of the rotary table.
申请公布号 JP2015070095(A) 申请公布日期 2015.04.13
申请号 JP20130202587 申请日期 2013.09.27
申请人 TOKYO ELECTRON LTD 发明人 KATO HISASHI;MIURA SHIGEHIRO
分类号 H01L21/31;C23C16/52;H01L21/316;H01L21/318 主分类号 H01L21/31
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