| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an epoxy resin having a low softening point, being capable of making a uniform cured product due to its solution stability, and allowing the cured product to have high thermal conductivity, an epoxy resin composition containing the epoxy resin of the present invention, prepreg, and a cured product thereof.SOLUTION: The epoxy resin is obtained through the following steps (A) to (C). The step (A): one or more compounds represented with a hydroxyalkyl benzophenone derivative and a compound represented with a hydroxybenzaldehyde derivative are reacted to obtain a phenolic compound (a). The step (B): the phenolic compound (a) obtained in the step (A) is reacted with epihalohydrin in the presence of an alkali metal hydroxide to obtain an epoxy resin (b). The step (C): the epoxy resin (b) obtained in the step (B) is heated to 150°C or more and a crystal component in the resin is melted, followed by quick cooling to 50°C or less.</p> |
