| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a manufacturing method of a high-reliable circuit board superior in via connection stability.SOLUTION: The multilayer circuit board has a circuit pattern which is formed by laminating, over a base material, an inner layer circuit substrate on which a convex circuit pattern having a specific thickness is formed; a prepreg filled with a conductive paste; and a metal foil as the outermost layer. Specific through holes are subject to a laser processing several times at an identical point or while shifting at a minimum pitch. Compared to an ordinary through hole, a plastic sheet has a PET embossment having an increased thickness and the amount of filled conductive paste is also increased. The compression rate is improved and the connection resistance value is stabilized. Thus, the manufacturing method of the circuit board with high connection reliability between the layers is achieved.</p> |
