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发明名称
半导体晶圆硏磨装置用弹性膜
摘要
申请公布号
TWD167111
申请公布日期
2015.04.11
申请号
TW102307327
申请日期
2013.11.14
申请人
荏原制作所股份有限公司
发明人
福岛诚;安田穂积;并木计介;锅谷治;富樫真吾;山木暁
分类号
15-99
主分类号
15-99
代理机构
代理人
林志刚 台北市中山区南京东路2段125号7楼
主权项
地址
日本
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