VACUUM DEPOSITION APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a vacuum deposition apparatus which can reduce a vapor deposition rate upon completion of vapor deposition as well as being able to calculate the vapor deposition rate more correctly and easily adjust an evaporation material to a predetermined pressure loss.SOLUTION: A vacuum deposition apparatus 1 which performs vacuum deposition on a substrate K under a reduced pressure includes: a crucible 2 which provides an evaporation material by evaporating a vapor deposition material M; a flow rate-adjusting valve 22 which adjusts a flow rate of the evaporation material; an introduction pipe 3 which introduces the evaporation material; a diffusion container 41 which introduces and diffuses the evaporation material of the introduction pipe 3; a discharge hole 42 which discharges the evaporation material inside the diffusion container 41 toward the substrate k; and a flow rate measurement mechanism 31 provided in the introduction pipe 3. The flow rate measurement mechanism 31 includes; a pressure loss valve 32 downstream the flow rate adjusting valve 22; two pressure sensors 33u and 33l which are provided upstream and downstream the pressure loss valve 32, respectively; and a controller 5 which adjusts the flow rate-adjusting valve 22 based on a pressure difference which is calculated from both pressures of the evaporation material measured with the pressure sensors 33u and 33l.