| 摘要 |
PROBLEM TO BE SOLVED: To reduce a resistance component caused by wiring, in a semiconductor device having a transistor.SOLUTION: Between a plurality of transistor units TRU, a source wiring wire SOI and a drain wiring wire DRI are alternately provided. One of bonding wires WIR1 is connected to the source wiring wire SOI1 at a plurality of points. The other one of the bonding wires WIR1 is connected to the source wiring wire SOI2 at a plurality of points. One of bonding wires WIR2 is connected to the drain wiring wire DRI1 at a plurality of points. The other one of the bonding wires WIR2 is connected to the drain wiring wire DRI2 at a plurality of points. |
