| 摘要 |
<p>The purpose of the present invention is to provide a light emitting diode module which has a plastic heat sink which has improved heat dissipation by improving heat transmission steps through a composite consisting of polymer plastic resin and high heat dissipation filter. For this, the present invention includes: a heat sink body which has a plurality of heat dissipation pins formed in a lower part and is made of a composite consisting of polymer plastic resin and high heat dissipation filter; and a conductive pattern which has a circuit formed on the upper side of the heat sink body. Therefore, the present invention can improve heat dissipation by improving heat transmission steps through a composite consisting of polymer plastic resin and high heat dissipation filter. A circuit is directly formed on a plastic heat sink, thereby improving heat transmission processes and heat dissipation efficiency. The structure of a light emitting diode is simplified, thereby facilitating manufacture and improving heat dissipation efficiency.</p> |
