Hair treatment application system comprising an absorbent substrate

摘要

The present invention describes a hair treatment application system, comprising at least one or more hair treatment compositions (15) having a viscosity of from 3,000 cPs to 150,000 cPs and a hair treatment application device (1) comprising a first plate (10) and a second plate (20) positionable in a juxtaposed relationship when said hair treatment application device (1) is in a closed state. The hair treatment application device (1) is characterized by having a first zone comprising at least one absorbent substrate (40) on the internal surface (101) of said at least said first plates (10) and a second zone (50) on said internal surface (101) which is free of said absorbent substrate (40). Said at least one absorbent substrate (40) has a median pore radius of from 300 microns to 3,000 micron. The present invention describes also methods of treating the hair with said hair treatment application system (10) and kit comprising said hair treatment application system.

主权项

1. A method to treat the hair comprising the step of contacting the hair with a hair treatment application system, said hair treatment application system comprising:
a) one or more hair treatment compositions having a viscosity of from about 3,000 cPs to about 150,000 cPs; and b) a hair treatment application device comprising a first plate and a second plate, wherein said first plate and said second plate are in a juxtaposed relationship when said hair treatment application device is in a closed state, wherein said first plate and said second plate are coupled together via a connection, wherein said first plate and said second plate each has an internal surface and an external surface, wherein said first plate and said second plate each has a perimeter edge, wherein said internal surface of said first plate comprises a first zone and a second zone, wherein said first zone comprises at least one absorbent substrate, wherein said at least one absorbent substrate has a median pore radius of from about 300 microns to about 3,000 microns, wherein said second zone is free of said at least one absorbent substrate, and wherein said connection comprises a spring back pressure to open of from 0.01 N/cm2 to 30.0 N/cm2.