发明名称 Substrate transfer method and storage medium
摘要 There is provided a substrate transfer method capable of preventing fine particles from adhering to a wafer. A substrate processing system 10 includes process modules 12 to 17 each having therein an inner space S1; a transfer module 11, having an inner space S2, connected to the process modules 12 to 17; and opening/closing gate valves 30 each partitioning the inner space S1 and the inner space S2. The transfer module 11 includes in the inner space S2 a transfer arm device 21 for holding a wafer W and for loading/unloading the wafer W into/from the process modules 12 to 17. The transfer arm device 21 holds the wafer W at a retreated position deviated from a facing position facing the gate valve 30 during an opening motion of the gate valve 30.
申请公布号 US9002494(B2) 申请公布日期 2015.04.07
申请号 US201113225672 申请日期 2011.09.06
申请人 Tokyo Electron Limited 发明人 Endo Eiki;Ogi Tatsuya
分类号 H01L21/677;H01L21/67 主分类号 H01L21/677
代理机构 Pearne & Gordon LLP 代理人 Pearne & Gordon LLP
主权项 1. A substrate transfer method performed by a substrate transfer system including: a substrate processing apparatus having therein a first inner space; a substrate transfer apparatus, having a second inner space, connected to the substrate processing apparatus; an opening/closing partition valve for partitioning the first inner space and the second inner space; and a buffer for receiving the substrate within the second inner space, the substrate transfer apparatus including in the second inner space a substrate transfer device for holding at least one substrate and for loading/unloading the at least one substrate into/from the substrate processing apparatus, the method comprising: before an opening motion of the opening/closing partition valve is started, transferring the substrate from the substrate transfer device to the buffer and lifting the substrate up to a retreated position which is higher than a port for communicating the first inner space to the second inner space; and after the opening motion of the opening/closing partition valve is finished, lowering the substrate to a height corresponding to said port and transferring the substrate from the buffer to the substrate transfer device, so that the substrate is positioned at a facing position facing the opening/closing partition valve.
地址 Tokyo JP