发明名称 Method and apparatus for manufacturing organic el device
摘要 Provided are a method and an apparatus for manufacturing an organic EL device which enable deposition of a vaporized material from an evaporation source onto a substrate in a desired pattern, while eliminating the need for a conventional strip-shaped shadow mask. A shielding portion 51 is configured to be switchable between a shield position where the shielding portion 51 is arranged between an evaporation source 4 and a substrate 81 so as to shield the substrate 81 and a shield release position where the shielding portion 51 is withdrawn from between the evaporation source 4 and the substrate 81 so as to release the shielding of the substrate 81. The shielding portion 51 is switched between the shield position and the shield release position while rotating together with a roller 3.
申请公布号 US8999735(B2) 申请公布日期 2015.04.07
申请号 US201214115793 申请日期 2012.12.10
申请人 Nitto Denko Corporation 发明人 Kakiuchi Ryohei;Yamamoto Satoru;Hida Kanako
分类号 H01L21/00;H01L51/50;H01L51/56;H01L51/00;C23C14/04;C23C14/56 主分类号 H01L21/00
代理机构 Westerman, Hattori, Daniels & Adrian, LLP 代理人 Westerman, Hattori, Daniels & Adrian, LLP
主权项 1. A method for manufacturing an organic EL device, comprising the steps of: providing a substrate having a strip shape while the substrate is in contact with a roller; depositing a vaporized material onto a predetermined part of the substrate by discharging the vaporized material from an evaporation source; and arranging a shielding portion for shielding the substrate between the evaporation source and the substrate so as to prevent the deposition of the vaporized material onto a part other than the predetermined part during the deposition of the vaporized material, wherein the shielding portion is switchable between a shield position where the shielding portion is arranged between the evaporation source and the substrate so as to shield the substrate and a shield release position where the shielding portion is withdrawn from between the evaporation source and the substrate so as to release the shielding of the substrate, and wherein the shielding portion is switched between the shield position and the shield release position while rotating together with the roller.
地址 Ibaraki-shi JP