Improvements relating to the mounting of a semiconductor on a base

摘要

1,068,190. Mounting semi-conductor bodies. GENERAL ELECTRIC CO. Oct. 6, 1964 [Nov. 4, 1963], No. 40768/64. Heading H1K. A semi-conductor body is mounted on a ceramic support by coating the support with a metallizing mix having therein particles of Si and/or Ge, heating the support to form a layer from the coating, etching the layer to expose the particles, flowing over the etched layer a layer of brazing material of Au, Ag or an alloy or intermetallic compound thereof, positioning the body on the layer of brazing material and brazing the body thereto. An alumina ceramic support 1 is coated with a mixture 4 containing Mo, Mn, Si and SiO 2 together in PVC or copoly-isobutyl methacrylate and butyl carbitol acetate as a binder, and then fired to drive off the binder to give an adherent film wherein the silicon particles 3 are slightly sintered. The film is etched with HNO 3 to remove Mn and Mo and then with HF to remove SiO 2 and clean the silicon particles. A brazing material 5 which contains Sb or Al to prevent the formation of a rectifying contact, is placed on the etched film and heated so that it melts and is uniformly distributed around and over, the particles to give a smooth surface upon which may be alloyed the semi-conductor body 6 thereby giving good electrical contact. In an embodiment (Fig. 9, not shown) two semi-conductor bodies are mounted on a ceramic support.