| 摘要 |
The purpose of the present invention is to provide an imaging module and an endoscope device with which images having excellent image quality can be obtained, and with which a reduction in the size of a tip of an insertion part can be achieved. This imaging module (40) is provided with: a solid-state imaging element (44); a substrate (45) which extends in a direction of an optical axis of the solid-state imaging element (44); and a stacked substrate (46) which is formed on a surface of the substrate (45), and which has electronic components (55-58) mounted thereto. The imaging module (40) is characterized in that: the electronic components (57 and 58) are embedded in the stacked substrate (46); and a transmission path of an image signal and a transmission path of a drive signal diverge at a position closer to a solid-state imaging element (44) side than the electronic components (57 and 58) embedded in the stacked substrate, and thus the image signal and the drive signal are transmitted via different layers in the substrate (45) and the stacked substrate (46). |
