发明名称 |
DRIVER INTEGRATED CIRCUIT CHIP, DISPLAY DEVICE HAVING THE SAME, AND METHOD OF MANUFACTURING A DRIVER INTEGRATED CIRCUIT CHIP |
摘要 |
A driver integrated circuit chip is provided. The driver integrated circuit chip includes a base substrate including at least one driver integrated circuit, a plurality of metal lines, and a passivation layer covering the driver integrated circuit and the metal lines; a plurality of input bumps arranged near a first longer side of the base substrate; a plurality of output bumps arranged near a second longer side of the base substrate; and a plurality of dummy bumps arranged on a central region of the base substrate, the dummy bumps being arranged between the input bumps and the output bumps. Each of the dummy bumps has a stacked layer structure that is different from a stacked layer structure of each of the input bumps and the output bumps. |
申请公布号 |
US2015091163(A1) |
申请公布日期 |
2015.04.02 |
申请号 |
US201414490373 |
申请日期 |
2014.09.18 |
申请人 |
Samsung Display Co., LTD. |
发明人 |
KIM Dong-Wook |
分类号 |
H01L23/00;H01L21/768 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
1. A driver integrated circuit chip comprising:
a base substrate including at least one driver integrated circuit, a plurality of metal lines, and a passivation layer covering the driver integrated circuit and the metal lines; a plurality of input bumps arranged near a first longer side of the base substrate; a plurality of output bumps arranged near a second longer side of the base substrate; and a plurality of dummy bumps arranged on a central region of the base substrate, the dummy bumps being arranged between the input bumps and the output bumps, wherein each of the dummy bumps has a stacked layer structure that is different from a stacked layer structure of each of the input bumps and the output bumps. |
地址 |
Yongin-City KR |