| 发明名称 |
EXTERNAL CONNECTION TERMINAL, SEMICONDUCTOR PACKAGE HAVING EXTERNAL CONNECTION TERMINAL, AND METHODS FOR MANUFACTURING THE SAME |
| 摘要 |
Disclosed herein are an external connection terminal part, a semiconductor package having the external connection terminal part, and a method for manufacturing the same. According to a preferred embodiment of the present invention, the external connection terminal part includes an insulating material and metal plating pattern formed on both surfaces of the insulating material. |
| 申请公布号 |
US2015091177(A1) |
申请公布日期 |
2015.04.02 |
| 申请号 |
US201314142719 |
申请日期 |
2013.12.27 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
Hong Chang Seob;Jo Eun Jung;Oh Kyu Hwan;Lee Kang Hyun |
| 分类号 |
H01L23/482;H01L23/00 |
主分类号 |
H01L23/482 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An external connection terminal part, comprising:
an insulating material; and metal plating patterns formed on both sides of the insulating material, wherein a whole lower and upper surfaces of the insulating material are exposed. |
| 地址 |
Suwon-si KR |
