发明名称 Heat sink structure and method of making the same
摘要 <p>1,079,382. Semi-conductor devices. WESTINGHOUSE ELECTRIC CORPORATION. March 24, 1965 [April 3, 1964], No. 12486/65. Heading H1K. An electrical component (as shown, a siliconcontrolled rectifier 10 contained in a hermetic enclosure 12 as described in Specification 1,009,926) is mounted on a block 34 forming part of a heat sink which further comprises a plurality of fins 42, there being an interference fit between the block 34 and the fins 42. Between each pair of adjacent fins are a looserfitting tin-plated brass spacer 44 and a solder ring 46. The fins 42 and a thicker top-plate 40 to be used for mounting the structure are preferably of tin-plated copper, the central block 34 of copper, aluminium, or an alloy thereof. The top plate 40 is a press fit against a knurled edge on the block 34, whereas each fin 42 is initially provided with a central aperture slightly smaller in diameter than the block 34 and is then upset round the periphery of this aperture, placed in position over the block 34, and flattened so that the edge of the aperture is forced into an interference fit with the block (Fig. 4, not shown).</p>
申请公布号 GB1079382(A) 申请公布日期 1967.08.16
申请号 GB19650012486 申请日期 1965.03.24
申请人 WESTINGHOUSE ELECTRIC CORPORATION 发明人
分类号 H01L23/367;H01L23/49 主分类号 H01L23/367
代理机构 代理人
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