| 摘要 |
The present invention relates to an embedded multilayer ceramic electronic component and a manufacturing method thereof. More particularly, the present invention relates to an embedded multilayer ceramic electronic component and a manufacturing method thereof. The embedded multilayer ceramic electronic component has an external electrode band surface of a constant distance or more to connect an external line through a via hole and reduces the thickness of the external electrode and increases the thickness of the ceramic body, thereby improving the strength of a chip and preventing the generation of breakage. |
