发明名称 電子部品
摘要 <p>An electronic component has an integrated protective device which responds in the event of a thermal overload and interrupts a current flow through the component. The protective device has an electrical terminal which may be brought under spring pretension by intrinsic resilience and assumes a mounting position in the pretensioned state and a current interrupting position in the untensioned state.</p>
申请公布号 JP5695069(B2) 申请公布日期 2015.04.01
申请号 JP20120537330 申请日期 2010.09.09
申请人 发明人
分类号 H01L23/58;H01H37/46 主分类号 H01L23/58
代理机构 代理人
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