| 发明名称 |
LED device, method of manufacturing the same, and light-emitting apparatus |
| 摘要 |
The LED device (27) has a LED bare chip (25) mounted directly on a metal contact (28), and supplies power to the bare chip and conducts heat from the bare chip via the metal contact. |
| 申请公布号 |
EP2854187(A1) |
申请公布日期 |
2015.04.01 |
| 申请号 |
EP20140180793 |
申请日期 |
2011.01.18 |
| 申请人 |
JAPAN AVIATION ELECTRONICS INDUSTRY, LTD. |
发明人 |
KANNO, HIDEYUKI |
| 分类号 |
H01L33/48;F21K9/90;F21V7/05;F21V17/12;F21Y101/00;F21Y103/33;F21Y105/10;F21Y115/10;H01L25/075;H01L33/62;H01L33/64;H05K1/02;H05K3/30;H05K3/32 |
主分类号 |
H01L33/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
