Method of splitting up a semiconductor wafer into individual semiconductor chips

摘要

1,093,197. Semi-conductor processing. TELEFUNKEN PATENTVERWERTUNGS G.m.b.H. Nov. 11, 1966 [Nov. 23, 1965], No. 50581/66. Heading H1K. A second semi-conductor wafer is broken into individual chips by first placing the wafer in a resilient material envelope 5, preferably transparent, evacuating and sealing the edge of the envelope by for example, thermal contact welding with electrodes 8. The wafer is then broken such as by rolling a roller across it, the chips being maintained in position by atmospheric pressure on the evacuated envelope. The welded seams are cut away and the free top surface of the envelope lifted to expose the individual chips still in orderly arrangement for subsequent removal by, for example, a suction lifting device.