发明名称 Molded image sensor package and method
摘要 An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.
申请公布号 US8994860(B2) 申请公布日期 2015.03.31
申请号 US201213350619 申请日期 2012.01.13
申请人 发明人 Webster Steven
分类号 H04N5/335;H04N5/225;G02B7/02;H01L27/146;H01L31/0203;H01L31/0232;H01L23/00 主分类号 H04N5/335
代理机构 McAndrews, Held & Malloy, Ltd. 代理人 McAndrews, Held & Malloy, Ltd.
主权项 1. A method comprising: mounting an image sensor die to a packaging substrate, the packaging substrate comprising: a lower surface;an upper surface;a plurality of side surfaces connecting the upper and lower surfaces of the packaging substrate; anda perimeter edge at which the upper and side surfaces of the packaging substrate meet; electrically connecting the image sensor die to traces on the upper surface of the packaging substrate; providing a molding comprising a lower base portion, an upper lens holder extension portion, and a window pocket between the lower base portion and the upper lens holder extension portion, where the window pocket comprises a lower shelf surface facing generally toward the lower base portion; after said providing a molding, attaching an upper surface of a window having no optical power to the lower shelf surface of the window pocket, such that the upper surface of the window will face away from the packaging substrate and a lower surface of the window will face the packaging substrate when the molding is attached to the packaging substrate; attaching the lower base portion of the molding to the upper surface of the packaging substrate at the perimeter edge of the packaging substrate; supporting a lens in a lens support; and coupling the lens support to the lens holder extension portion of the molding in a manner that provides for movement of the lens support toward and away from the image sensor die.
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